Bondexpo is the world’s number one industry and user meeting place. With a clear and consistent focus on the joining/connecting process chain through gluing, casting, sealing and foaming, economical detailed and system solutions are offered for current and future challenges in the field of joining and connecting a wide variety of materials. This also applies to new requirements in terms of resource conservation and material and energy efficiency through material mix/hybrid designs for lightweight construction or miniaturization for microsystem technology applications. Suppliers of adhesive technology will find the ideal setting here to introduce themselves to the specialist audience from the globalized production world.
Exhibition Scope
- Assembly systems and basic systems
- Handling technology
- Process technology for joining, processing, testing and
- Marking
- Components for special machine construction
- Software and services
Venue: Messe Stuttgart
